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Routing in the Third Dimension: From VLSI Chips to MCMs (Ieee Press Series on Microelectronic Systems)



Description:

This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.

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