This comprehensive volume provides an in-depth discussion of the
fundamentals of cleaning and surface conditioning of semiconductor
applications such as high-k/metal gate cleaning, copper/low-k
cleaning, high dose implant stripping, and silicon and SiGe
passivation. The theory and fundamental physics associated with wet
etching and wet cleaning is reviewed, plus the surface and
colloidal aspects of wet processing. Formulation development
practices and methodology are presented along with the applications
for preventing copper corrosion, cleaning aluminum lines, and other
sensitive layers. This is a must-have reference for any engineer or
manager associated with using or supplying cleaning and
contamination free technologies for semiconductor manufacturing.
From the Reviews...
"This handbook will be a valuable resource for many academic
libraries. Many engineering librarians who work with a variety of
programs (including, but not limited to Materials Engineering)
should include this work in their collection. My recommendation
is to add this work to any collection that serves a campus with a
materials/manufacturing/electrical/computer engineering programs
and campuses with departments of physics and/or chemistry with
large graduate-level enrollment."
—Randy Wallace, Department Head, Discovery Park Library,
University of North Texas