This book presents a wide-band and technology independent,
SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D
integrated circuits. This model accounts for a variety of effects,
including skin effect, depletion capacitance and nearby contact
effects. Readers will benefit from in-depth coverage of concepts
and technology such as 3D integration, Macro modeling, dimensional
analysis and compact modeling, as well as closed form equations for... more...