Our website is made possible by displaying online advertisements to our visitors.
Please consider supporting us by disabling your ad blocker.

Download links will be available after you disable the ad blocker and reload the page.

This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.