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Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or... more...

Design, development and life-cycle management of any electromechanical product is a complex task that requires a cross-functional team spanning multiple organizations, including design, manufacturing, and service. Ineffective design techniques, combined with poor communication between various teams, often leads to delays in product launches, with last minute design compromises and changes. The purpose of Design of Electromechanical... more...

As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively... more...